Enhancing boiling heat transfer by ultrafast laser texturing of groove structures on thin-film graphene surfaces

In the microelectronics industry, efficient high heat flux removal is increasingly important and can be achieved by enhancing the wettability of boiling surfaces. The heat dissipation performance of boiling heat transfer is determined by two key indicators: increasing heat flux and improving the heat transfer coefficient. This study employed a simple and efficient method to pattern screen-printed thin-film graphene surfaces, aiming to optimize both heat flux and heat transfer coefficient. The boiling surfaces were modified using ultrafast picosecond laser texturing. Results demonstrated that the improvement in boiling heat transfer was directly proportional to the groove widths created by laser texturing on the thin-film graphene surfaces. The laser texturing surface of G4 exhibited the highest heat transfer coefficient with a value of 63 kW/m2 K, representing an enhancement of 135 %. Therefore, ultrafast laser texturing on thin-film graphene surfaces can be significantly enhanced through a straightforward and rapid method, making it a promising substrate for industrial applications to enhance boiling heat transfer.