Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints

被引：1
作者：
Yao, Yifan [1 ]
Lu, Zhunan [1 ]
An, Yuxuan [2 ]
Tu, K. N. [1 ,2 ,3 ]
Liu, Yingxia [2 ]
机构：
[1] City Univ Hong Kong, Dept Mat Sci & Engn, Hong Kong, Peoples R China
[2] City Univ Hong Kong, Dept Syst Engn, Hong Kong, Peoples R China
[3] City Univ Hong Kong, Dept Elect Engn, Hong Kong, Peoples R China
来源：
ELECTRONIC MATERIALS LETTERS | 2025年 / 21卷 / 01期
关键词：
Solder joint; Electromigration; Sn grain orientation; Current crowding; INTERMETALLIC COMPOUNDS; BETA-SN; CU; ANISOTROPY; THERMOMIGRATION; MECHANISM; DIFFUSION; ISSUES;
D O I：
10.1007/s13391-024-00535-7
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Electromigration (EM) failure in solder joints is a persistent reliability concern, especially in advanced electronic packaging structures. In this study, we conducted an EM experiment on solder joints with asymmetric under-bump-metallization (UBM) thicknesses. Open failure occurred at the solder joint with no current crowding effect but the highest atomic flux of EM, which is related to Sn grain orientation. Our work tries to reveal a counteracting effect of Sn grain orientation on current crowding and the essential reason for the EM failure mechanism of solder joints.
引用
收藏
页码：134 / 143
页数：10
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