共 50 条
- [41] High frequency interconnections using electrically conductive adhesives MIKON-98: 12TH INTERNATIONAL CONFERENCE ON MICROWAVES & RADAR, VOLS 1-4, 1998, : 680 - 683
- [42] Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 305 - +
- [43] A study of electrically conductive adhesives as a manufacturing solder alternative Journal of Electronic Materials, 2006, 35 : 912 - 921
- [45] ELECTRICAL, STRUCTURAL AND PROCESSING PROPERTIES OF ELECTRICALLY CONDUCTIVE ADHESIVES IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (08): : 843 - 851
- [46] ELECTRICALLY CONDUCTIVE ADHESIVES - A PROSPECTIVE ALTERNATIVE FOR SMD SOLDERING IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02): : 292 - 298
- [47] Electrical characterizations and considerations of electrically conductive adhesives (ECAs) INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 336 - 342
- [48] Properties of Porous Copper Filled Electrically Conductive Adhesives 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 221 - +
- [49] Characterization and performance of electrically conductive adhesives for microwave applications 4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS, 2000, : 232 - 239
- [50] Electrically conductive adhesives as solder alternative: A feasible challenge MATERIALS FOR INFORMATION TECHNOLOGY: DEVICES, INTERCONNECTS AND PACKAGING, 2005, : 363 - 375