Electrically conductive adhesives

被引：0
|
作者：
Gordon, Rachel [1 ]
机构：
[1] IDTechEx, UK Headquarters, Cambridge,CB25 ONW, United Kingdom
来源：
Coating International | 2016年 / 49卷 / 03期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：10 / 11
相关论文
共 50 条
  • [1] ELECTRICALLY CONDUCTIVE COMPOSITE ADHESIVES
    Florian, Stepan
    Novak, Igor
    41. MEZINARODNI KONFERENCE O NATEROVYCH HMOTACH, KNH 2010, 2010, : 13 - 18
  • [2] Characterization of electrically conductive adhesives
    Eitner, U.
    Geipel, T.
    Holtschke, S. -N.
    Tranitz, M.
    PROCEEDINGS OF THE 2ND INTERNATIONAL CONFERENCE ON CRYSTALLINE SILICON PHOTOVOLTAICS (SILICONPV 2012), 2012, 27 : 676 - 679
  • [3] Electrically conductive adhesives: An assessment
    Universitaet Erlangen-Nuernberg, Erlangen, Germany
    SMT Surf Mount Technol Mag, 5 (74, 76, 78):
  • [4] Electrically Conductive Epoxy Adhesives
    Sancaktar, Erol
    Bai, Lan
    POLYMERS, 2011, 3 (01) : 427 - 466
  • [5] Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics
    Heckmann, Thibaut
    Souvignet, Thomas
    Naccache, David
    DIGITAL INVESTIGATION, 2017, 21 : 53 - 64
  • [6] Cure kinetics of electrically conductive adhesives
    Geipel, Torsten
    Eitner, Ulrich
    PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON CRYSTALLINE SILICON PHOTOVOLTAICS (SILICONPV 2013), 2013, 38 : 340 - 347
  • [7] Fatigue behavior of electrically conductive adhesives
    George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 801 Ferst Drive NW, Atlanta, GA 30332-0405, United States
    Journal of Adhesion Science and Technology, 2008, 22 (08): : 927 - 946
  • [8] PROPERTIES OF MODIFIED ELECTRICALLY CONDUCTIVE ADHESIVES
    Ratislav, Marek
    Pilarcikova, Ivana
    Busek, David
    Mach, Pavel
    NANOCON 2011, 2011, : 421 - 426
  • [9] Reliability of flexible electrically conductive adhesives
    Cui, Hui-wang
    Li, Dong-sheng
    Fan, Qiong
    POLYMERS FOR ADVANCED TECHNOLOGIES, 2013, 24 (01) : 114 - 117
  • [10] Electrically conductive adhesives and underfills - Foreword
    Morris, JE
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (02): : 139 - 140
12345