共 15 条
A Physics-Based Compact Electrothermal Model of β -Ga2O3 MOSFETs for Device-Circuit Co-Design
被引:0
|作者:
Zhou, Kai
[1
]
Zhou, Xuanze
[1
]
He, Song
[1
]
Xu, Guangwei
[1
]
Wang, Lingfei
[2
]
Wang, Yibo
[3
]
Han, Genquan
[4
]
Long, Shibing
[1
]
机构:
[1] Univ Sci & Technol China, Sch Microelect, Hefei 230026, Peoples R China
[2] Chinese Acad Sci, Key Lab Microelect Devices & Integrat Technol, Inst Microelect, Beijing 100029, Peoples R China
[3] Chinese Acad Sci, Suzhou Inst Nanotech & Nanobion SINANO, Suzhou 215123, Peoples R China
[4] Xidian Univ, Sch Microelect, Key Lab Wide Band Gap Semicond Mat & Devices, Xian 710071, Peoples R China
来源:
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
|
2024年
/
14卷
/
12期
关键词:
Semiconductor device modeling;
MOSFET;
Mathematical models;
Substrates;
Computational modeling;
Analytical models;
Logic gates;
Beta-gallium oxide (beta-Ga2O3) metal-oxide-semiconductor field-effect transistors (MOSFETs);
channel temperature;
compact model;
design-technology co-optimization (DTCO);
electrothermal coupling;
self-heating effect (SHE);
THERMAL MANAGEMENT;
BETA-GA2O3;
PERFORMANCE;
RESISTANCE;
D O I:
10.1109/TCPMT.2024.3439337
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
The electrothermal coupling effect on transistors is an intractableness of power circuits optimization, particularly for recent novel materials with high performance but low thermal conductivity, like beta-gallium oxide (beta -Ga2O3). Self-consistent calculations of electrothermal coupling effect in beta -Ga2O3 metal-oxide-semiconductor field-effect transistors (MOSFETs) are essential to assess the thermal behavior from device to circuit level. In this article, we proposed a physics-based compact electrothermal model of beta -Ga2O3 MOSFETs. Analytical solutions of current, terminal charge, and channel temperature are obtained based on surface potential, Ward-Dutton's charge-partitioning scheme, and Fourier's heat conduction law, respectively. Moreover, temperature-dependence mobility and device power dissipation are employed to couple electrical and thermal properties by embedding a two-order RC thermal subcircuit. The model is rigidly verified by comparing against experimental data and 3-D-FEM simulations under different process conditions. Especially, the calibrated model is used to evaluate the effect of technology parameters such as substrate material and thickness on boost converter performance, providing design space in design-technology co-optimization (DTCO) flow.
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页码:2231 / 2239
页数:9
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