Electrical-thermal-structural Coupling Analysis of Through Silicon Vias in 3D Packaging

被引：0
|
作者：
Zhang, Yuanle [1 ]
Gong, Yufan [1 ]
Chen, Zhaochuan [1 ]
Zhao, Qi [1 ]
Meng, Xin [1 ]
Li, Qiang [1 ]
Chen, Xuemei [1 ]
机构：
[1] School of Energy and Power Engineering, Nanjing University of Science and Technology, Nanjing,210094, China
来源：
Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics | 2024年 / 45卷 / 11期
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摘要：
15
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页码：3508 / 3516
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