Interfacial electromigration for accelerated reactions

被引:0
|
作者
Edwards, Madison E. [1 ]
Sengupta, Annesha [1 ]
Freitas, Dallas P. [1 ]
Hirtzel, Erin A. [1 ]
Chen, Xi [1 ]
Kim, Joohan J. [1 ]
Yan, Xin [1 ]
机构
[1] Texas A&M Univ, Dept Chem, 580 Ross St, College Stn, TX 77843 USA
基金
美国国家科学基金会;
关键词
Interfacial microreactor; Microdroplet acceleration; Mass spectrometry; Electromigration; DESORPTION ELECTROSPRAY-IONIZATION; MASS-SPECTROMETRY; CHEMICAL-REACTIONS; HIGH-THROUGHPUT; BOND; OXIDATION; LIPIDS;
D O I
10.1016/j.aca.2025.343854
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Background: Microdroplets have emerged as effective confined-volume reactors due to their remarkable ability to accelerate chemical reactions compared to bulk systems. Recent research highlights the crucial role of air-liquid interfaces in this acceleration. A microdroplet can be viewed as having two kinetically distinct regions: the interface and the interior. Although the surface area represents a small portion of the total droplet, the overall reaction acceleration hinges on efficient diffusion, ensuring that a substantial proportion of reagents reach the interface for rapid surface reactions. In larger droplets, however, the rate of acceleration can be hindered by slower diffusion. Results: In this study, we present a novel method that employs electromigration to deliver reactants directly to the surface of a chemical solution contained within an 80 mu m diameter theta capillary. This approach, termed as the large orifice theta interfacial microreactor, enhances reaction rates by overcoming diffusion limitations and ensuring immediate acceleration at the air-liquid interface. We applied this approach to accelerated Pd electrocatalysis, electro-oxidative C-H/N-H coupling, and multi-level lipid derivatization. Moreover, by controlling thin film electromigration, we can selectively control product formation in competing reactions, the ability to selectively control product formation in competing reactions, such as the electro-oxidative C-H/N-H coupling of phenothiazine (PTZ) and N,N '-dimethylaniline (DMA), v.s. the dimerization of DMA, and lipid epoxidation v.s. Mn adduction, a feature unattainable in traditional single-barrel or bulk reactions. Significance: This work introduces a novel platform for accelerating chemical reactions at microdroplet interfaces. The large orifice theta interfacial microreactor not only improves reaction rates by overcoming diffusion barriers but also allows for selective product formation in multi-reaction systems. This method opens new avenues for studying and harnessing the unique properties of microdroplet interfaces for accelerated chemical reactions. Its potential for enhancing reaction selectivity and efficiency marks a significant advancement in the field of microdroplet chemistry.
引用
收藏
页数:8
相关论文
共 50 条
  • [31] Interfacial Electromigration for Analysis of Biofluid Lipids in Small Volumes
    Edwards, Madison E.
    Freitas, Dallas P.
    Hirtzel, Erin A.
    White, Nicholas
    Wang, Hongying
    Davidson, Laurie A.
    Chapkin, Robert S.
    Sun, Yuxiang
    Yan, Xin
    ANALYTICAL CHEMISTRY, 2023, 95 (50) : 18557 - 18563
  • [32] Generalized phenomenological model for the effect of electromigration on interfacial reaction
    Hsu, Chia-Ming
    Wong, David Shan-Hill
    Chen, Sinn-Wen
    JOURNAL OF APPLIED PHYSICS, 2007, 102 (02)
  • [33] Effect of interfacial dissolution on electromigration failures at metals interface
    Lin, E. J.
    Hsu, Y. C.
    Chuang, Y. C.
    Liu, C. Y.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 28 (20) : 15149 - 15153
  • [34] Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects
    Zhou, Y
    Scherban, T
    Xu, GH
    He, J
    Miner, B
    Jan, CH
    Ott, A
    O'Loughlin, J
    Ingerly, D
    Leu, J
    ADVANCED METALLIZATION CONFERENCE 2004 (AMC 2004), 2004, : 189 - 199
  • [35] Relationship between interfacial adhesion and electromigration in Cu metallization
    Lloyd, JR
    Lane, MW
    Liniger, EG
    2002 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP - FINAL REPORT, 2002, : 32 - 35
  • [36] Generalized phenomenological model for the effect of electromigration on interfacial reaction
    Hsu, Chia-Ming
    Wong, David Shan-Hill
    Chen, Sinn-Wen
    1600, American Institute of Physics, 2 Huntington Quadrangle, Suite N101, Melville, NY 11747-4502, United States (102):
  • [37] Effect of interfacial dissolution on electromigration failures at metals interface
    E. J. Lin
    Y. C. Hsu
    Y. C. Chuang
    C. Y. Liu
    Journal of Materials Science: Materials in Electronics, 2017, 28 : 15149 - 15153
  • [38] Relationship between interfacial adhesion and electromigration in Cu metallization
    Lane, MW
    Liniger, EG
    Lloyd, JR
    JOURNAL OF APPLIED PHYSICS, 2003, 93 (03) : 1417 - 1421
  • [39] Extrapolation of highly accelerated electromigration tests on copper to operation conditions
    von Hagen, J
    Bauer, R
    Penka, S
    Pietsch, A
    Walter, W
    Zitzelsberger, A
    2002 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP - FINAL REPORT, 2002, : 41 - 44
  • [40] Effect of interfacial condition on electromigration for narrow and wide copper interconnects
    Cheng, Yi-Lung
    Wang, Ying-Lang
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2008, 8 (05) : 2494 - 2499