Interfacial electromigration for accelerated reactions

被引:0
|
作者
Edwards, Madison E. [1 ]
Sengupta, Annesha [1 ]
Freitas, Dallas P. [1 ]
Hirtzel, Erin A. [1 ]
Chen, Xi [1 ]
Kim, Joohan J. [1 ]
Yan, Xin [1 ]
机构
[1] Texas A&M Univ, Dept Chem, 580 Ross St, College Stn, TX 77843 USA
基金
美国国家科学基金会;
关键词
Interfacial microreactor; Microdroplet acceleration; Mass spectrometry; Electromigration; DESORPTION ELECTROSPRAY-IONIZATION; MASS-SPECTROMETRY; CHEMICAL-REACTIONS; HIGH-THROUGHPUT; BOND; OXIDATION; LIPIDS;
D O I
10.1016/j.aca.2025.343854
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Background: Microdroplets have emerged as effective confined-volume reactors due to their remarkable ability to accelerate chemical reactions compared to bulk systems. Recent research highlights the crucial role of air-liquid interfaces in this acceleration. A microdroplet can be viewed as having two kinetically distinct regions: the interface and the interior. Although the surface area represents a small portion of the total droplet, the overall reaction acceleration hinges on efficient diffusion, ensuring that a substantial proportion of reagents reach the interface for rapid surface reactions. In larger droplets, however, the rate of acceleration can be hindered by slower diffusion. Results: In this study, we present a novel method that employs electromigration to deliver reactants directly to the surface of a chemical solution contained within an 80 mu m diameter theta capillary. This approach, termed as the large orifice theta interfacial microreactor, enhances reaction rates by overcoming diffusion limitations and ensuring immediate acceleration at the air-liquid interface. We applied this approach to accelerated Pd electrocatalysis, electro-oxidative C-H/N-H coupling, and multi-level lipid derivatization. Moreover, by controlling thin film electromigration, we can selectively control product formation in competing reactions, the ability to selectively control product formation in competing reactions, such as the electro-oxidative C-H/N-H coupling of phenothiazine (PTZ) and N,N '-dimethylaniline (DMA), v.s. the dimerization of DMA, and lipid epoxidation v.s. Mn adduction, a feature unattainable in traditional single-barrel or bulk reactions. Significance: This work introduces a novel platform for accelerating chemical reactions at microdroplet interfaces. The large orifice theta interfacial microreactor not only improves reaction rates by overcoming diffusion barriers but also allows for selective product formation in multi-reaction systems. This method opens new avenues for studying and harnessing the unique properties of microdroplet interfaces for accelerated chemical reactions. Its potential for enhancing reaction selectivity and efficiency marks a significant advancement in the field of microdroplet chemistry.
引用
收藏
页数:8
相关论文
共 50 条
  • [1] Electromigration effect upon the Zn/Ni and Bi/Ni interfacial reactions
    Chen, CM
    Chen, SW
    JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) : 1222 - 1228
  • [2] Electromigration effect upon the Zn/Ni and Bi/Ni interfacial reactions
    Chih-Ming Chen
    Sinn-Wen Chen
    Journal of Electronic Materials, 2000, 29 : 1222 - 1228
  • [3] Electromigration effects upon interfacial reactions in flip-chip solder joints
    Chen, SW
    Lin, SK
    Jao, JM
    MATERIALS TRANSACTIONS, 2004, 45 (03) : 661 - 665
  • [4] On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints
    Attari, Vahid
    Ghosh, Supriyo
    Thien Duong
    Arroyave, Raymundo
    ACTA MATERIALIA, 2018, 160 : 185 - 198
  • [5] Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect
    Zhang, X. F.
    Guo, J. D.
    Shang, J. K.
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (03) : 425 - 429
  • [6] Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect
    X.F. Zhang
    J.D. Guo
    J.K. Shang
    Journal of Electronic Materials, 2009, 38 : 425 - 429
  • [7] Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures
    Chen, CM
    Chen, SW
    ACTA MATERIALIA, 2002, 50 (09) : 2461 - 2469
  • [8] Interfacial reactions and nucleation of WAl12 phase on electromigration in hydrogen exposed semiconductor interconnects
    Kim, Jin Seok
    Choe, Jin Hyun
    Ahn, Da Won
    Jung, Eun Soo
    Pyo, Sung Gyu
    APPLIED SURFACE SCIENCE, 2023, 613
  • [9] Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects
    M. L. Huang
    S. M. Zhou
    L. D. Chen
    Journal of Electronic Materials, 2012, 41 : 730 - 740
  • [10] Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects
    Huang, M. L.
    Zhou, S. M.
    Chen, L. D.
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (04) : 730 - 740