Sustainably sourced epoxy thermal management composites with simultaneously improved thermal conductivity, dielectric properties and fire safety

被引:0
|
作者
Wu, Guan-Long [1 ]
Li, Yu [1 ]
Zhu, Ji-Xin [1 ]
Hu, Yuan [1 ]
Gui, Zhou [1 ]
Wang, Xin [1 ]
机构
[1] State Key Laboratory of Fire Science, University of Science and Technology of China, 96 Jinzhai Road, Anhui, Hefei,230026, China
来源
Chemical Engineering Journal | 1600年 / Elsevier B.V.卷 / 508期
关键词
Number: -, Acronym: USTC, Sponsor: University of Science and Technology of China, Number: 22375195,22075265, Acronym: NSFC, Sponsor: National Natural Science Foundation of China, Number: -, Acronym: NSFC, Sponsor: National Natural Science Foundation of China, Number: 2308085J05, Acronym: -, Sponsor: Science Fund for Distinguished Young Scholars of Anhui Province, Number: -, Acronym: -, Sponsor: Science Fund for Distinguished Young Scholars of Anhui Province, Number: 2021459, Acronym: YIPA CAS, Sponsor: Youth Innovation Promotion Association of the Chinese Academy of Sciences, Number: -, Acronym: YIPA CAS, Sponsor: Youth Innovation Promotion Association of the Chinese Academy of Sciences,;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] Dielectric and Thermal Properties of Boron Nitride and Silica Epoxy Composites
    Couderc, H.
    Frechette, M.
    Savoie, S.
    Reading, M.
    Vaughan, A. S.
    CONFERENCE RECORD OF THE 2012 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRICAL INSULATION (ISEI), 2012, : 64 - 68
  • [22] Dielectric and thermal properties of epoxy/boron nitride nanotube composites
    Zhi, Chunyi Y.
    Bando, Yoshio
    Terao, Takeshi
    Tang, Chengchun
    Golberg, Dmitri
    PURE AND APPLIED CHEMISTRY, 2010, 82 (11) : 2175 - 2183
  • [23] Effect of Micron Thermal Conductive Filler on Thermal Conductivity and Electrical Properties of Epoxy Composites
    Tuo, Rui
    Zhang, Yiran
    Yang, Wei
    He, Shaojian
    Xie, Qing
    Lin, Jun
    Bian, Xingming
    2019 IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA (CEIDP), 2019, : 717 - 720
  • [24] Reaction-induced phase separation towards in situ network in epoxy resins for simultaneously improving thermal conductivity and fire safety
    Xu, Shao-Dong
    Gu, Song
    Pu, Xiao-Lu
    Xiao, Yan-Fang
    Lu, Jia-Hui
    Wang, Yu-Zhong
    Chen, Li
    COMPOSITES PART B-ENGINEERING, 2022, 247
  • [25] High Thermal Conductivity Epoxy/BN Composites with Sufficient Dielectric Breakdown Strength
    Tanaka, Toshikatsu
    Wang, Zengbin
    Iizuka, Tomonori
    Kozako, Masahiro
    Ohki, Yoshimichi
    2011 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, VOLS 1 AND 2, 2011, : 691 - 694
  • [26] Epoxy Composites with Added Aluminum with Binary Particle Size Distribution for Enhanced Dielectric Properties and Thermal Conductivity
    Sui, Xuezhen
    Zhou, Wenying
    Dong, Lina
    Wang, Zijun
    Wu, Peng
    Zuo, Jing
    Cai, Huiwu
    Liu, Xiangrong
    JOURNAL OF ELECTRONIC MATERIALS, 2016, 45 (11) : 5974 - 5984
  • [27] Synchronously enhancing thermal conductivity and dielectric properties in epoxy composites via incorporation of functionalized boron nitride
    Lim, Taeyoon
    Yoo, Jeseung
    Park, Hyuk
    Ansar, Sabah
    Rabani, Iqra
    Seo, Young-Soo
    DALTON TRANSACTIONS, 2024, 53 (26) : 10961 - 10973
  • [28] Epoxy Composites with Added Aluminum with Binary Particle Size Distribution for Enhanced Dielectric Properties and Thermal Conductivity
    Xuezhen Sui
    Wenying Zhou
    Lina Dong
    Zijun Wang
    Peng Wu
    Jing Zuo
    Huiwu Cai
    Xiangrong Liu
    Journal of Electronic Materials, 2016, 45 : 5974 - 5984
  • [29] Preparation and properties of MWCNTs-BNNSs/epoxy composites with high thermal conductivity and low dielectric loss
    Wang, Rui
    Xie, Congzhen
    Luo, Shoukang
    Xu, Huasong
    Gou, Bin
    Zeng, Leilei
    MATERIALS TODAY COMMUNICATIONS, 2020, 24
  • [30] Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites
    Huang, Xingyi
    Iizuka, Tomonori
    Jiang, Pingkai
    Ohki, Yoshimichi
    Tanaka, Toshikatsu
    JOURNAL OF PHYSICAL CHEMISTRY C, 2012, 116 (25): : 13629 - 13639