Pseudo-Labeling Based Semi-Supervised Learning for Signal Integrity Analysis of High-Bandwidth Memory (HBM) Interposer

被引:1
作者
Mao, Chang-Sheng [1 ]
Wang, Da-Wei [1 ]
Zhao, Wen-Sheng [1 ]
Hu, Yue [2 ]
机构
[1] Hangzhou Dianzi Univ, Innovat Ctr Elect Design Automat Technol, Sch Elect & Informat Sch IC Sci & Engn, Hangzhou 310018, Peoples R China
[2] Hangzhou Dianzi Univ, MOE Res Engn Ctr Smart Sensors & Microsyst, Sch Elect & Informat, Hangzhou 310018, Peoples R China
基金
中国国家自然科学基金;
关键词
Convolutional neural networks; Training; Accuracy; Silicon; Convolution; Semisupervised learning; Crosstalk; Receivers; Voltage measurement; Signal integrity; Eye diagram; impairment diagnosis; machine learning (ML); signal integrity (SI); silicon interposer; DESIGN;
D O I
10.1109/TEMC.2024.3474431
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this article, a pseudolabeling (PL) based semisupervised learning method is proposed to identify the eye diagram distortion for accurately locating the signal integrity (SI) problems of high-bandwidth memory (HBM) silicon interposer channels. First, four main factors influencing the eye diagrams are presented, and 12 different eye diagram distortions are considered. The proposed convolutional neural network (CNN) and four different models are trained to identify these eye diagram distortions, and it is demonstrated that the proposed CNN exhibits good performance. Then, the PL method is applied to further improve the model performance. Finally, with the combination of the proposed CNN and PL method, the accuracy reaches up to 97.5% and becomes 32.3% higher than LeNet. Simultaneously, the graphic processing unit memory usage of the proposed model is 39.2% less than that of AlexNet. The proposed method provides an effective way for fast and accurately localizing the source of the SI problems for HBM interposer.
引用
收藏
页码:2056 / 2064
页数:9
相关论文
共 37 条
[1]   State-of-the-art in artificial neural network applications: A survey [J].
Abiodun, Oludare Isaac ;
Jantan, Aman ;
Omolara, Abiodun Esther ;
Dada, Kemi Victoria ;
Mohamed, Nachaat AbdElatif ;
Arshad, Humaira .
HELIYON, 2018, 4 (11)
[2]   Semi-Supervised Learning Based on Hybrid Neural Network for the Signal Integrity Analysis [J].
Chen, Siyu ;
Chen, Jienan ;
Zhang, Tingrui ;
Wei, Shuwu .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2020, 67 (10) :1934-1938
[3]   A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method [J].
Cheng, Tai-Yu ;
Wang, Chuen-De ;
Chiou, Yih-Peng ;
Wu, Tzong-Lin .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2012, 22 (06) :303-305
[4]  
Cho JH, 2018, ISSCC DIG TECH PAP I, P208, DOI 10.1109/ISSCC.2018.8310257
[5]  
Cho J, 2017, 2017 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & SIGNAL/POWER INTEGRITY (EMCSI), P411, DOI 10.1109/ISEMC.2017.8077905
[6]   Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface [J].
Cho, Kyungjun ;
Kim, Youngwoo ;
Lee, Hyunsuk ;
Kim, Heegon ;
Choi, Sumin ;
Song, Jinwook ;
Kim, Subin ;
Park, Junyong ;
Lee, Seongsoo ;
Kim, Joungho .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (09) :1658-1671
[7]  
Cho K, 2016, 2016 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC)
[8]   An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC [J].
Choi, Sumin ;
Kim, Heegon ;
Jung, Daniel H. ;
Kim, Jonghoon Jay ;
Lim, Jaemin ;
Kim, Joungho .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2017, 59 (03) :927-939
[9]  
Chou CC, 2012, IEEE C ELECTR PERFOR, P131, DOI 10.1109/EPEPS.2012.6457859
[10]   A Compact Passive Equalizer Design for Differential Channels in TSV-Based 3-D ICs [J].
Fu, Kai ;
Zhao, Wen-Sheng ;
Wang, Da-Wei ;
Wang, Gaofeng ;
Swaminathan, Madhavan ;
Yin, Wen-Yan .
IEEE ACCESS, 2018, 6 :75278-75292