Development of a Flexible Capacitive Tactile-Proximity Sensor Array With CMOS Integration for Enhanced Sensitivity

被引:0
|
作者
Tsao, Chi-Tang [1 ,2 ]
Lu, Michael S. -C. [1 ,2 ]
机构
[1] Natl Tsing Hua Univ, Dept Elect Engn, Hsinchu 300044, Taiwan
[2] Natl Tsing Hua Univ, Inst Elect Engn, Hsinchu 300044, Taiwan
关键词
Capacitive sensors; complementary metal-oxide-semiconductor (CMOS); tactile-proximity sensors; INTERFACE; FILM;
D O I
10.1109/JSEN.2024.3486106
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The integration of tactile and proximity sensors enhances our ability to perceive and interact with both touchable and touch-free objects within our environment. Flexible electronics technology, particularly in capacitive sensing, provides an ideal foundation for developing advanced tactile-proximity sensors. In this study, we present an integrated capacitive tactile-proximity sensor that combines with complementary metal-oxide-semiconductor (CMOS) readout circuitry to achieve enhanced sensitivity and system miniaturization. By utilizing four metal layers from two flexible substrates available through commercial technology, we efficiently fabricate an 8 x 8 tactile sensor array integrated with proximity sensing capabilities. Finite-element simulations are conducted to validate the measured data. Experiment results demonstrate that the tactile sensors achieve an average sensitivity of 2.2 MPa-1 with a resolution of 255 Pa, while the proximity sensing exhibits a detection range of approximately 15 mm with a resolution better than 1.9 mu m. These findings demonstrate the significant potential of flexible tactile-proximity sensors for applications requiring high sensitivity and precision in detection.
引用
收藏
页码:40541 / 40548
页数:8
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    (1) Oga Inc., Takaoka, Toyama 933-0871, Japan; (2) Toyama Industrial Technology Center, Takaoka 933-0981, Japan; (3) Nano-Science and Nano-Enginieering, Waseda University, Shinjuku, Tokyo 169-8555, Japan, 1600, Components, Packaging, and Manufacturing; Int. Microelectronics and Packaging Society (iMAPS); Technology (IEEE CPMT) Society Japan Chapter; The Japan Institute of Electronics Packaging (JIEP) (IEEE Computer Society):