Photoresist Development for 3D Printing of Conductive Microstructures via Two-Photon Polymerization

被引:2
作者
Zhou, Xin [1 ]
Liu, Xiaojiang [1 ]
Gu, Zhongze [1 ]
机构
[1] Southeast Univ, Sch Biol Sci & Med Engn, State Key Lab Digital Med Engn, Nanjing 211189, Peoples R China
基金
中国博士后科学基金; 中国国家自然科学基金;
关键词
3D printing; conductive filler; conductive microstructure; photoresist; two-photon polymerization; CARBON NANOTUBES; FABRICATION; COMPOSITES;
D O I
10.1002/adma.202409326
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The advancement of electronic devices necessitates the development of three-dimensional (3D) high-precision conductive microstructures, which have extensive applications in bio-electronic interfaces, soft robots, and electronic skins. Two-photon polymerization (TPP) based 3D printing is a critical technique that offers unparalleled fabrication resolution in 3D space for intricate conductive structures. While substantial progress has been made in this field, this review summarizes recent advances in the 3D printing of conductive microstructures via TPP, mainly focusing on the essential criteria of photoresist resins suitable for TPP. Further preparation strategies of these photoresists and methods for constructing 3D conductive microstructures via TPP are discussed. The application prospects of 3D conductive microstructures in various fields are discussed, highlighting the imperative to advance their additive manufacturing technology. Finally, strategic recommendations are offered to enhance the construction of 3D conductive microstructures using TPP, addressing prevailing challenges and fostering significant advancements in manufacturing technology. This review summarizes recent advances in the three-dimensional (3D) printing of conductive microstructures via two-photon polymerization, focusing on essential criteria and preparation strategies of photoresists, and offering strategic recommendations to enhance 3D conductive microstructure construction. image
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页数:21
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