Study of the effect of circular p-GaN gate on the DC characteristics of AlGaN/GaN HEMTs

被引:0
作者
Zhu, Yanxu [1 ]
Wang, Yuhan [1 ]
Luo, Dan [2 ]
Yang, Xiaolong [1 ]
Li, Qian [1 ]
Fei, Baoliang [1 ]
Gong, Yanfei [1 ]
机构
[1] Beijing Univ Technol, Key Lab Photoelect Technol, Minist Educ, Beijing 100124, Peoples R China
[2] Natl Ind Informat Secur Dev Res Ctr, Beijing 100040, Peoples R China
关键词
AlGaN/GaN HEMT; p-GaN; silvaco; DC characteristics; breakdown voltage; RF; PERFORMANCE;
D O I
10.1088/1361-6641/ada9ca
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we use Silvaco-ATLAS two-dimensional numerical simulation to calculate the performance of two different circular-gate AlGaN/GaN HEMT device models. The influence of the special circular-gate structure on the DC characteristics of the AlGaN/GaN HEMT device is studied and compared with that of conventional devices. Compared with conventional, the threshold voltage of the drain-center and source-center circular-gate devices increased from 1.1 V to 1.5 V, while the transconductance improved from 245 mS mm-1 to 328 mS mm-1 and 285 mS mm-1 respectively. In the on-state of devices, the maximum saturation output current increased from 536 mA mm-1 to 620 mA mm-1 and 650 mA mm-1 . Furthermore, the breakdown voltage of the source-center circular-gate device rose from 765 V to 870 V compared to conventional devices; however, for the drain-center circular-gate device it was only at 685 V due to concentrated electric fields outside the drain region-this limitation can be effectively addressed by increasing the drain area. Simulation results demonstrate that circular-gate AlGaN/GaN HEMT devices can avoid edge effects, improve electric field distribution, and alleviate self-heating effects.
引用
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页数:9
相关论文
共 30 条
[1]  
[Anonymous], 2019, ATLAS USERS MANUAL D
[2]   RF Enhancement-Mode p-GaN Gate HEMT on 200 mm-Si Substrates [J].
Cheng, Yan ;
Ng, Yat Hon ;
Zheng, Zheyang ;
Chen, Kevin J. .
IEEE ELECTRON DEVICE LETTERS, 2023, 44 (01) :29-31
[3]   Improved RF Performances by Applying Asymmetric Passivation and Air-Bridged Field Plate in AlGaN/GaN HEMTs With Reliability-Based Simulation [J].
Choi, Jun-Hyeok ;
Kim, Dohyung ;
Lee, Seo-Jun ;
Kim, Ji-Hun ;
Cho, Yoon-A ;
Min, Byoung-Gue ;
Kang, Dong Min ;
Kim, Hyun-Seok .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024, 71 (01) :468-475
[4]   Novel Enhance-Mode AlGaN/GaN JFET With BV of Over 1.2 kV Maintaining Low RON,sp [J].
Duan, Baoxing ;
Yuan, Jiahui ;
Wang, Yandong ;
Yang, Luoyun ;
Yang, Yintang .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (03) :1200-1205
[5]   A survey of Gallium Nitride HEMT for RF and high power applications [J].
Fletcher, A. S. Augustine ;
Nirmal, D. .
SUPERLATTICES AND MICROSTRUCTURES, 2017, 109 :519-537
[6]   Recent Advances in GaN-Based Power HEMT Devices [J].
He, Jiaqi ;
Cheng, Wei-Chih ;
Wang, Qing ;
Cheng, Kai ;
Yu, Hongyu ;
Chai, Yang .
ADVANCED ELECTRONIC MATERIALS, 2021, 7 (04)
[7]   Modeling and Simulation of Fe-Doped GaN PCSS in High-Power Microwave [J].
Huang, Jia ;
Hu, Long ;
Yang, Xianghong ;
Sun, Yue ;
Li, Xin ;
Liu, Chunliang .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2023, 70 (07) :3489-3495
[8]   Study of p-GaN Gate MOS-HEMT with Al2O3 Insulator for High-Power Applications [J].
Huang, Kuan Ning ;
Lin, Yueh Chin ;
Wu, Chieh Ying ;
Lee, Jin Hwa ;
Hsu, Chia Chieh ;
Yao, Jing Neng ;
Chien, Chao Hsin ;
Chang, Edward Yi .
JOURNAL OF ELECTRONIC MATERIALS, 2023, 52 (04) :2865-2870
[9]   Reliability, Applications and Challenges of GaN HEMT Technology for Modern Power Devices: A Review [J].
Islam, Naeemul ;
Mohamed, Mohamed Fauzi Packeer ;
Khan, Muhammad Firdaus Akbar Jalaludin ;
Falina, Shaili ;
Kawarada, Hiroshi ;
Syamsul, Mohd .
CRYSTALS, 2022, 12 (11)
[10]   5.65 GHz High-Efficiency GaN HEMT Power Amplifier With Harmonics Treatment up to Fourth Order [J].
Kamiyama, Masahiro ;
Ishikawa, Ryo ;
Honjo, Kazuhiko .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2012, 22 (06) :315-317