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Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method
被引:0
|作者:
Wei, Hegeng
[1
,2
]
Zhang, Zexi
[1
]
Li, Zebo
[1
]
Peng, Linfeng
[1
]
Yang, Guannan
[1
]
Zhao, Tianshuo
[3
]
Zhang, Yu
[1
]
Huang, Guanghan
[1
]
Cui, Chengqiang
[1
]
机构:
[1] Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipment, Guangzhou 510006, Peoples R China
[2] Hechi Univ, Sch Artificial Intelligence & Smart Mfg, Yizhou 546300, Peoples R China
[3] Univ Hong Kong, Dept Elect & Elect Engn, Hong Kong 999077, Peoples R China
来源:
基金:
中国国家自然科学基金;
关键词:
Heat dissipation;
Graphene-metal composite;
Interconnect material;
Silver solder paste;
Third-generation semiconductor;
COPPER MATRIX COMPOSITES;
GRAPHENE OXIDE;
ANTICORROSION PERFORMANCE;
THERMAL-CONDUCTIVITY;
SHEAR-STRENGTH;
MICROSTRUCTURE;
NANOCOMPOSITE;
PROPERTY;
JOINT;
PASTE;
D O I:
10.1016/j.jmrt.2024.11.163
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
Graphene and its derivatives have excellent thermal conductivity, and are common additives for metal-based nanocomposites. However, the easy aggregation of graphene and metal nanoparticles severely limits uniform mixing, and hinders development and performance improvement of metal/graphene composites. Herein, we developed a dual-dispersion medium method to fabricate a silver-graphene oxide (Ag/GO) composite with high thermal/electrical conductivity and mechanical performance. Through the method, GO and silver particles are dispersed evenly in different media and then fully mixed, thereby GO sheets can be uniformly dispersed and form a network in the matrix of silver particles. By adding a low GO content of 0.2 wt%, the density of the sintered Ag/ GO joint increased from 9.0 to 9.5 g/cm3, the shear strength increased from 45.8 to 71.9 MPa, the thermal conductivity increased from 234.2 to 375.2 W/(m center dot K), and the electrical resistivity reduced from 4.6 to 1.9 mu Omega cm. The added GO sheets form a coating layer with good interfacial bonding on the surface of most silver particles and form a uniform network in the Ag matrix. In addition, the added GO sheets reduce the overall thermal expansion coefficient and agglomerate size, thereby improving the sintering density and heat transfer efficiency of the Ag/GO composite. Because of its comprehensive properties, the Ag/GO composite material in this study exhibits good potential as a heat dissipation material for packaging and interconnect applications of high-powerdensity electronic devices.
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页码:8211 / 8221
页数:11
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