Analytical Study on the Warpage Deformation of Die Attach Structure in Power Devices

被引：2

作者：

Luan, Xinghe ^{[1
]}

Ding, Liguo ^{[2
]}

Li, Xuemin ^{[2
]}

Zhang, Hongjie ^{[2
]}

Li, Kewei ^{[2
]}

Zhou, Longzao ^{[1
]}

Wu, Fengshun ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, Sch Mat Sci & Engn, State Key Lab Mat Proc & Die & Mould Technol, Wuhan 430074, Hubei, Peoples R China

[2] Chengdu Perfect Technol Co Ltd, Chengdu 610404, Sichuan, Peoples R China

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2024年 / 14卷 / 11期

基金：

中国国家自然科学基金;

关键词：

Stress; Deformation; Microassembly; Strain; Substrates; Young's modulus; Plastics; Thermal expansion; Packaging; Nonhomogeneous media; Die attach structure; interconnect layer thickness; material physical parameters; warpage deformation; MICROSTRUCTURE EVOLUTION; RELIABILITY; MODEL;

D O I：

10.1109/TCPMT.2024.3481464

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

According to the theory of elastic-plastic mechanics, the stress and deformation of a die attach structure under a temperature load were studied. An analytical relation between the deformation and the material physical parameters (coefficient of thermal expansion, Young's modulus, yield stress, tangent modulus, and Poisson's ratio) and geometric dimensions (thickness and length) was established, and the correctness of the relation was verified through experiments. The trends of the experimental and calculated values were consistent, with errors of about 20%. The increase in interconnect layer thickness and chip thickness and the decrease in chip length are beneficial to reduce the warping deformation.

引用

页码：1959 / 1967

页数：9

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