Progress on Research of Thermal Oxidation Stability of Polyimide Films

被引：0
|
作者：
Jing, Wang [1 ]
Shuang, Yang [1 ]
Cunyong, Xiao [1 ]
Zhengyin, Yu [1 ]
Jun, Zhang [1 ]
机构：
[1] School of Materials Science and Engineering, Liaoning Key Laboratory of Advanced Polymer Matrix Composites, Shenyang Aerospace University, Shenyang
来源：
Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering | 2024年 / 40卷 / 08期
关键词：
heat resistance; high thermal conductivity; modification; polyimide; thermal oxygen aging;
D O I：
10.16865/j.cnki.1000-7555.2024.0148
中图分类号：
学科分类号：
摘要：
In recent years, polyimide has been widely used in high temperature devices, so higher requirements are put forward for temperature resistance of materials. Polyimide in the high temperature environment above 300 ℃ will occur thermal oxygen aging, resulting in the deterioration of material properties. In this paper, the mechanism of thermo- oxygen aging of polyimide films and modification method were introduced. Firstly, the molecular structure modification of polyimide was introduced, and the methods of introducing rigid structures such as benzimidazole and benzooxazole into the chain segments to improve the thermal stability of polyimide films were summarized. Secondly, the modification of filler blend was introduced, and the thermal stability of PI films is further improved by introducing layered silicates, carbides or metal oxides and hybrid of high thermal conductivity filler. The research progress and development status of thermal oxidation stability of surface modified and coating modified PI films at home and abroad were briefly introduced. Finally, the future development directions of PI film with high temperature resistance and high thermal conductivity were summarized and prospected. © 2024 Sichuan University. All rights reserved.
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页码：155 / 164
页数：9
相关论文
共 45 条
  • [1] Xong B, Xu M, Zhu Z H, Et al., Preparation and characterization of polyimide materials containing fluorine and benzene ring side groups, Polymer Materials Science & Engineering, 38, 1, pp. 19-26, (2022)
  • [2] Zha J W, Wang F., Research progress of high thermal conductivity polyimide dielectric films, Acta Physica Sinica, 71, 23, pp. 190-207, (2022)
  • [3] Gao M Y, Wang C O, Jia Y, Et al., Research and progress on anisotropic thermal conductivity of polyimide thin film, Acta Polymerica Sinica, 52, 10, pp. 1283-1297, (2021)
  • [4] Wang Z Y, He Z Y, Ding X C, Et al., Oxazole-containing polyimide films with better dimensional stability, Polymer Materials Science & Engineering, 39, 1, pp. 145-150, (2023)
  • [5] Xu S Y, Lei X F, Lian R H, Et al., Research progress of high performance thermosetting polyimide resins, Polymer Materials Science & Engineering, 37, 5, pp. 149-162, (2021)
  • [6] Liu Y, Xu X S, Mo S, Et al., Study on Thermal oxidation degradation kinetics of PMDA/ODA polyimide films, Acta Polymerica Sinica, 51, 10, pp. 1169-1177, (2020)
  • [7] Wang Q Q, Zhou Y P, Zheng H B, Et al., Research and application of high temperature resistant polyimide resin and its composites [J], Engineering Plastics Application, 47, 8, pp. 144-147, (2019)
  • [8] Daolei L, Runyue L, Yue L, Et al., Clarifying the effect of moisture absorption and high-temperature thermal aging on structure and properties of polyimide film at molecular dynamic level, Polymer, 214, (2021)
  • [9] Hao Y F., Synthesis and properties of polyimide containing inorganic heteroatoms, (2022)
  • [10] Khazaka R, Diaham S, Locatelli M L, Et al., Thermal and thermooxidative aging effects on the dielectric properties of thin polyimide films coated on metal substrate, 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, (2011)
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