共 50 条
- [32] The effect of intermetallic bonding on blocking electromigration induced interfacial diffusion in Cu dual damascene interconnects 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, : 153 - 155
- [34] A metallurgical prescription for electromigration (EM) reliability improvement in scaled-down, Cu dual damascene interconnects PROCEEDINGS OF THE IEEE 2006 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2006, : 89 - 91
- [35] Die-based electromigration characterization for copper/low-K dual damascene interconnects 2006 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS, 2006, : 131 - +
- [36] Behaviors of precipitates, voids, and hillocks in electromigration stressed Al-2wt%Cu interconnects MATERIALS RELIABILITY IN MICROELECTRONICS VII, 1997, 473 : 357 - 362
- [37] Improvement in reliability of Cu dual-damascene interconnects using Cu-Al alloy seed ADVANCED METALLIZATION CONFERENCE 2004 (AMC 2004), 2004, : 221 - 226
- [38] Mechanisms of Electromigration under AC and Pulsed-DC Stress in Cu/Low-k Dual Damascene Interconnects 2015 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2015,
- [39] Characterization of Cu extrusion failure mode in dual-damascene Cu/low-k interconnects under electromigration reliability test PROCEEDINGS OF THE 2001 8TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2001, : 174 - 177