Influence of Ta2O5 crystallization on the performance of capacitors for high-density DRAMs

被引:0
|
作者
Furukawa, R. [1 ]
Kanda, N. [1 ]
Yamamoto, H. [1 ]
Yoshida, T. [1 ]
Yamagami, N. [1 ]
Uemura, T. [1 ]
Honma, T. [1 ]
Kanai, M. [1 ]
Kunitomo, M. [1 ]
Takahashi, M. [1 ]
Uchiyama, H. [1 ]
Ohji, Y. [1 ]
机构
[1] Hitachi, Ltd, Tokyo, Japan
关键词
Capacitance - Capacitors - Crystallization - Dielectric films - Dynamic random access storage - Grain growth - Thin film devices - X ray crystallography;
D O I
暂无
中图分类号
学科分类号
摘要
The capacitance needed for the long refresh time of high-density DRAMs can be obtained by using a Ta2O5 capacitor. We found that the electrical characteristics of this capacitor are strongly related to the crystallization of Ta2O5 thin films. Accordingly, we found that a Ta2O5 crystal with a low intensity ratio (I200/I001) surprisingly improves the electrical characteristics of the Ta2O5 capacitor. Our technique for controlling grain growth in the Ta2O5 film formation improves the electrical characteristics of a Ta2O5 capacitor considerably.
引用
收藏
页码:249 / 252
相关论文
共 50 条
  • [21] RF, DC, and reliability characteristics of Ta2O5 MIM capacitors
    Richard, Mikael
    Dean, Thierry
    Delage, Sylvain
    2008 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, 2008, : 672 - 675
  • [22] TA2O5 PLASMA CVD TECHNOLOGY FOR DRAM STACKED CAPACITORS
    NUMASAWA, Y
    KAMIYAMA, S
    ZENKE, M
    SAKAMOTO, M
    1989 INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST, 1989, : 43 - 46
  • [23] Low Crystallization Temperature for Ta2O5 Thin Films
    Lin, J.
    Suzuki, T.
    Matsunaga, D.
    Hieda, K.
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2003, 42 (11): : 7023 - 7024
  • [24] Permittivity Enhancement of Ta2O5/Co/Ta2O5 Trilayer Films
    Ding, Y.
    Yao, Y. D.
    Wu, K. T.
    Hsu, J. C.
    Hung, D. S.
    Wei, D. H.
    Lin, Y. H.
    IEEE TRANSACTIONS ON MAGNETICS, 2011, 47 (03) : 710 - 713
  • [25] Study of dry and electrogenerated Ta2O5 and Ta/Ta2O5/Pt structures by XPS
    Kerrec, O
    Devilliers, D
    Groult, H
    Marcus, P
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1998, 55 (1-2): : 134 - 142
  • [26] 1.5nm equivalent thickness Ta2O5 high-k dielectric with rugged Si suited for mass production of high density DRAMs
    Asano, I
    Kunitomo, M
    Yamamoto, S
    Furukawa, R
    Sugawara, Y
    Uemura, T
    Kuroda, J
    Kanai, M
    Nakata, M
    Tamaru, T
    Nakamura, Y
    Kawagoe, T
    Yamada, S
    Kawakita, K
    Kawamura, H
    Nakamura, M
    Morino, M
    Kisu, T
    Iijima, S
    Ohji, Y
    Sekiguchi, T
    Tadaki, Y
    INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, : 755 - 758
  • [27] THE DETERMINATION OF THE DENSITY OF TA, NB, AND ANODICALLY FORMED TA2O5 AND NB2O5
    SCHRIJNER, AJ
    MIDDELHOEK, A
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1964, 111 (10) : 1167 - 1169
  • [28] Effect of thermal oxide on the crystallization of the anodic Ta2O5 film
    Pozdeev-Freeman, Y
    Gladkikh, A
    JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (08) : 931 - 936
  • [29] Electrical characteristics of Ta2O5 based capacitors with different gate electrodes
    D. Spassov
    E. Atanassova
    D. Virovska
    Applied Physics A, 2006, 82 : 55 - 62
  • [30] Leakage current variation with time in Ta2O5 MIM and MIS capacitors
    Manceau, J-P.
    Bruyere, S.
    Jeannot, S.
    Sylvestre, A.
    Gonon, P.
    2006 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP, FINAL REPORT, 2006, : 129 - +