共 50 条
- [41] Influence of the dressing process on the grinding behavior in double face grinding – Dressing during double face grinding WT Werkstattstechnik, 2024, 114 (7-8): : 408 - 416
- [42] Selections of working conditions for creep feed grinding. Part(I) - thermal partition ratios INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2004, 23 (9-10): : 700 - 706
- [44] Influence of rigidity of the hardened parts on forming the shape accuracy during flat grinding INTERNATIONAL CONFERENCE ON MODERN TRENDS IN MANUFACTURING TECHNOLOGIES AND EQUIPMENT (ICMTMTE 2017), 2017, 129
- [45] Fine grinding of silicon wafers: a mathematical model for the chuck shape INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2003, 43 (07): : 739 - 746
- [46] Fine grinding of silicon wafers: a mathematical model for the wafer shape INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2004, 44 (7-8): : 707 - 716
- [48] Fine grinding of silicon wafers: A mathematical model for the chuck shape 1600, 739-746 (May 2003):