Electrocoagulation of chemical mechanical polishing (CMP) wastewater from semiconductor fabrication

被引：0
|
作者：
机构：
[1] Lai, Chen L.
[2] Lin, Sheng H.
来源：
Lin, S.H. (ceshlin@saturn.yzu.edu.tw) | 1600年 / Elsevier卷 / 95期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1 / 3
相关论文
共 50 条
  • [41] Microlens Array Fabrication by Chemical Mechanical Polishing
    Kumar, Purushottam
    Son, Seung-Young
    Lee, Jaeseok
    Chang, Feng-Chi
    Khanna, Aniruddh
    Arjunan, Arul Chakkaravarthi
    Singh, Rajiv K.
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2009, 12 (07) : H269 - H271
  • [42] Characterization of suspensions from chemical-mechanical polishing in the semiconductor industry
    Kuntzsch, T
    Hollatz, M
    Stintz, M
    Ripperger, S
    CHEMIE INGENIEUR TECHNIK, 2002, 74 (08) : 1151 - 1155
  • [43] Pretreatment of copper damascene wastewater from chemical and mechanical polishing.
    Smith, EH
    Daniels, M
    Bayan, M
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1999, 218 : U700 - U701
  • [44] Development of the inspection system of defects on a CMP (Chemical Mechanical Polishing) pad
    Kim, KW
    Yang, YS
    Chun, CS
    Chun, SM
    Lee, DC
    Choi, SY
    Choi, SB
    Park, SJ
    2001 IEEE INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, CONFERENCE PROCEEDINGS, 2001, : 415 - 417
  • [45] Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten
    Zhang, L
    Raghavan, S
    SCIENCE AND TECHNOLOGY OF SEMICONDUCTOR SURFACE PREPARATION, 1997, 477 : 115 - 123
  • [46] Treatment of alumina and silica chemical mechanical polishing waste by electrodecantation and electrocoagulation
    Belongia, BM
    Haworth, PD
    Baygents, JC
    Raghavan, S
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (11) : 4124 - 4130
  • [47] Models of nanoparticles movement, collision, and friction in chemical mechanical polishing (CMP)
    Filip Ilie
    Journal of Nanoparticle Research, 2012, 14
  • [48] Study on Nanoparticle Agglomeration During Chemical Mechanical Polishing (CMP) Performance
    Bakier, Mohammed A. Y. A.
    Suzuki, Keisuke
    Khajornrungruang, Panart
    JOURNAL OF NANOFLUIDS, 2021, 10 (03) : 420 - 430
  • [49] Chemical mechanical polishing: Future processes require CMP tool flexibility
    Schraub, FAT
    Boyd, J
    Valentine, J
    Curry, J
    MULTILEVEL INTERCONNECT TECHNOLOGY II, 1998, 3508 : 146 - 154
  • [50] Relating Friction and Processes Development during Chemical - Mechanical Polishing (CMP)
    Ilie, Filip
    Laurian, Tiberiu
    Tita, Constantin
    ADVANCED TRIBOLOGY, 2009, : 571 - +
12345