Electrocoagulation of chemical mechanical polishing (CMP) wastewater from semiconductor fabrication

被引：0

作者：

机构：

[1] Lai, Chen L.

[2] Lin, Sheng H.

来源：

Lin, S.H. (ceshlin@saturn.yzu.edu.tw) | 1600年 / Elsevier卷 / 95期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：1 / 3

共 50 条

[1] Electrocoagulation of chemical mechanical polishing (CMP) wastewater from semiconductor fabrication
Lai, CL
Lin, SH
CHEMICAL ENGINEERING JOURNAL, 2003, 95 (1-3) : 205 - 211
[2] Electrocoagulation of chemical mechanical polishing wastewater
Drouiche, N.
Ghaffour, N.
Lounici, H.
Mameri, M.
DESALINATION, 2007, 214 (1-3) : 31 - 37
[3] Chemical and physical treatments of chemical mechanical polishing wastewater from semiconductor fabrication
Lin, SH
Yang, CR
JOURNAL OF HAZARDOUS MATERIALS, 2004, 108 (1-2) : 103 - 109
[4] Adsorption treatment of oxide chemical mechanical polishing wastewater from a semiconductor manufacturing plant by electrocoagulation
Chou, Wei-Lung
Wang, Chih-Ta
Chang, Wen-Chun
Chang, Shih-Yu
JOURNAL OF HAZARDOUS MATERIALS, 2010, 180 (1-3) : 217 - 224
[5] Fabrication of volcano emitters using chemical mechanical polishing (CMP)
Busta, H
Gammie, G
Skala, S
Fury, M
Stell, M
Myers, T
IVMC '96 - 9TH INTERNATIONAL VACUUM MICROELECTRONICS CONFERENCE, TECHNICAL DIGEST, 1996, : 388 - 392
[6] CMP or CMP:: The balance in chemical mechanical polishing
Paul, Ed
ELECTROCHEMICAL AND SOLID STATE LETTERS, 2007, 10 (07) : H213 - H216
[7] Mechanisms of the chemical mechanical polishing (CMP) process in integrated circuit fabrication
Saka, N
Lai, JY
Chun, JH
Suh, NP
CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2001, 50 (01) : 233 - 238
[8] Performance of COD removal from oxide chemical mechanical polishing wastewater using iron electrocoagulation
Wang, Chih-Ta
Chou, Wei-Lung
JOURNAL OF ENVIRONMENTAL SCIENCE AND HEALTH PART A-TOXIC/HAZARDOUS SUBSTANCES & ENVIRONMENTAL ENGINEERING, 2009, 44 (12): : 1289 - 1297
[9] Characterization of slurries used for chemical-mechanical polishing (CMP) in the semiconductor industry
Kuntzsch, T
Witnik, U
Hollatz, M
Stintz, M
Ripperger, S
CHEMICAL ENGINEERING & TECHNOLOGY, 2003, 26 (12) : 1235 - 1239
[10] Electrocoagulation for the wastewater treatment of chemical mechanical polishing: Kinetic study of particle removal
Liu, Yi-Hung
Yen, Shi-Chern
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2019, 258

← 1 2 3 4 5 →