Zero clearance soldermask for high-density SMT

被引：0
|
作者：
Inaba, Ken [1 ]
Heffernan, John [2 ]
Numakura, Dominique [3 ]
机构：
[1] SSK Ltd., Ibaraki, Japan
[2] SSK Technology Inc., San Jose, CA, United States
[3] DKN Research, Haverhill, MA, United States
来源：
Printed Circuit Fabrication | 2003年 / 26卷 / 01期
关键词：
Consumer electronics - Electronics packaging - Laser applications - Masks - Printed circuit manufacture - Soldering - Surface mount technology;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Simple dimensional corrections to photomask cannot compensate for distortions on a panel or deviations related to lot-to-lot manufacturing. Hence, the soldermask process requires large dimensional allowances for alignment, eating up valuable real estate. A new LDI process and soldermask provide a novel remedy.
引用
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页码：18 / 21
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