Evaluation of the cure kinetics of isocyanate reactive hot-melt adhesives with differential scanning calorimetry

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[1] Cui, Yanjun
[2] Hong, Ling
[3] Wang, Xinling
[4] Tang, Xiaozhen
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Wang, X. (shenxw@online.sh.cn) | 1600年 / John Wiley and Sons Inc.卷 / 89期
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