THERMAL MANAGEMENT: A NECESSITY FOR ELECTRONICS EQUIPMENT.

被引：0

作者：

Hamilton, Sheila ^{[1
]}

机构：

[1] Enco Industries Ltd, Enco Industries Ltd

来源：

Engineering materials and design | 1987年 / 31卷 / 04期

关键词：

PRINTED CIRCUITS - Temperature Control - THERMAL EFFECTS;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Designing electronics equipment for the efficient removal of heat has developed out of being a fine art into an exact science involving specially produced components and the use of CAD for thermal mapping. Improved materials, better design and more advanced chips have all led to much higher packing densities on PCBs; this in turn leads to greater power densities leading to a need to dissipate the extra heat.

引用

页码：32 / 34