共 50 条
[42]
Novel flip-chip bonding technology using chemical process
[J].
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS,
2007,
:898-+
[43]
Tooling and procedures for hybrid integration of lasers by flip-chip technology
[J].
2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC),
2020,
[44]
LTCC module using flip-chip technology for mobile equipment
[J].
2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS,
2001, 4587
:283-286
[46]
Flip-chip bonded MEMS capacitor applied on tuning superconductive resonator
[J].
MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST,
2008,
:1004-+
[47]
Flip-chip BGA applied high-density organic substrate
[J].
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS,
1999,
:243-249
[48]
Flip-chip BGA applied high-density organic substrate
[J].
Proceedings - Electronic Components and Technology Conference,
1999,
:243-249
[50]
Issues in chip-package codesign with MCM-D/flip-chip technology
[J].
IEEE SYMPOSIUM ON IC/PACKAGE DESIGN INTEGRATION - PROCEEDINGS,
1998,
:88-92