共 50 条
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Evaluation of epoxy underfill materials for solder flip-chip technology
[J].
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1996,
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[32]
High performance coreless flip-chip BGA packaging technology
[J].
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS,
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[34]
Simulation of duplex solder joints geometry in flip-chip technology
[J].
Tien Tzu Hsueh Pao/Acta Electronica Sinica,
2000, 28 (05)
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[35]
Novel flip-chip interconnection technology for millimeter wave applications
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58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS,
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FLIP-CHIP ON BOARD CONNECTION TECHNOLOGY - PROCESS CHARACTERIZATION AND RELIABILITY
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1994, 17 (03)
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[38]
Development of flip-chip bonding technology for (Cd,Zn)Te
[J].
2003 IEEE NUCLEAR SCIENCE SYMPOSIUM, CONFERENCE RECORD, VOLS 1-5,
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A new flip-chip technology for high-density packaging
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46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS,
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[40]
Collective flip-chip technology for hybrid focal plane arrays
[J].
INFRARED TECHNOLOGY AND APPLICATIONS XXVI,
2000, 4130
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