共 50 条
- [21] Wafer-applied underfill: Flip-chip assembly and reliability IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2004, 27 (02): : 101 - 108
- [22] Flip-chip attachment of fine-pitch GaAs devices using ball-bumping technology International Journal of Microcircuits and Electronic Packaging, 1994, 17 (02): : 118 - 125
- [23] Flip-chip GaAs MMICs for microwave MCM-D applications 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 273 - 278
- [24] The flip-chip bump interconnection for millimeter-wave GaAs MMIC 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 47 - 52
- [28] Flip-chip mounted 26 v GaInP/GaAs power HBTs IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST, 2004, : 561 - 564
- [30] Analysis of RF flip-chip on-chip inductance with novel measurement technology 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1253 - 1257