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- [1] ULTRASONIC IN-PROCESS MEASUREMENT OF SILICON-WAFER THICKNESS PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1982, 4 (04): : 195 - 199
- [2] A new in-process method for wafer surface quality measurement J. Shanghai Jiaotong Univ. Sci., 2008, SUPPL. (124-126): : 124 - 126
- [3] A new in-process measurement method for wafer surface roughness ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 637 - 640
- [5] In-process measurement of the grinding force in silicon wafer self-rotating grinding process 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1050 - 1056
- [7] IN-PROCESS MEASUREMENT AND CONTROL FOR PRODUCTION PROCESS INTERNATIONAL JOURNAL OF THE JAPAN SOCIETY FOR PRECISION ENGINEERING, 1993, 27 (04): : 319 - 320
- [8] SELECTING INSTRUMENTATION FOR AUTOMOTIVE TEST AND MEASUREMENT. Automotive Engineering International, 1974, 82 (05): : 46 - 51
- [9] In-process measurement of concave mirror by fiber grating line-Hartmann test 17TH CONGRESS OF THE INTERNATIONAL COMMISSION FOR OPTICS: OPTICS FOR SCIENCE AND NEW TECHNOLOGY, PTS 1 AND 2, 1996, 2778 : 1159 - 1160
- [10] In-process measurement method for detection and discrimination of silicon wafer surface defects by laser scattered defect pattern CIRP ANNALS 1998 - MANUFACTURING TECHNOLOGY, VOL 47, NO 1, 1998, 47 : 459 - 462