New adhesion promoters for copper leadframes and epoxy resin

被引：0
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作者：
Müller, Rainer [1 ]
Heckmann, Klaus [1 ]
Habermann, Manfred [2 ]
Paul, Thomas [2 ]
Stratmann, Martin [2 ]
机构：
[1] Universität Regensburg, Labor fur Grenzflachenchemie, Postfach 101042, D-93040 Regensburg, Germany
[2] Univ. Erlangen-Nürnberg, Lehrst. Korrosion Oberflachentechnik, Martensstr. 7, D-98058 Erlangen, Germany
来源：
| 1600年 / Gordon & Breach Science Publ Inc, Reading, United Kingdom卷 / 72期
关键词：
This work was carried out as part of the INNOMONT project which has been supported by the German Federal Ministry of Education and Research (BMBF). The authors wish to thank Mr. E. Schmidhuber; Mrs. A. Atzesdorfer and Mr. A. Neu from SIEMENS AG Regens-burg; Semiconductors Packaging Technology; for the excellent co-operation during this project;
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摘要：
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