Reflow soldering: meeting the SMT challenge

被引：0

作者：

Lee, Ning-Cheng ^{[1
]}

机构：

[1] Indium Corp of America, Utica, United States

来源：

Advancing Microelectronics | 1996年 / 23卷 / 01期

关键词：

Assembly - Bonding - Capacitors - Intermetallics - Lead - Mathematical models - Powders - Printed circuit design - Resistors - Soldering - Surface mount technology - Tin;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

This paper discusses the important issues facing reflow soldering. The issues addressed include leaching, intermetallics, non-wetting, skewing, lead-free soldering, among others. By meeting these issues, reflow soldering can remain the vital SMT assembly processing method in the ultra-fine-pitch era.

引用

页码：19 / 21