CHIP TEMPERATURE MEASUREMENT.

被引：0
作者：
Jung, E.
Klein, W.
Najmann, K.
Richter, S.
机构：
来源：
IBM technical disclosure bulletin | 1984年 / 27卷 / 4 B期
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D O I：
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摘要：
INTEGRATED CIRCUIT MANUFACTURE
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页码：2421 / 2422
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