OPTICAL I/O HYBRID MICROELECTRONICS PACKAGING.

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作者：

Peterson, Gary J.

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来源：

SME Technical Paper (Series) EE | 1979年 / EE79-23期

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摘要：

This paper gives an insight into new concepts used in optical I/O hybrid microelectronics design and packaging. The scope of the paper is limited to a solid state laser hybrid package. Package parameter requirements are discussed in depth, especially the optical and thermal parameters. Manufacturing methods presented include assembly, substrate fabrications, reflow solder processes, precision component alignments, interconnection wire bonding, and encapsulation.

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