Experimental Investigation on Cooling Enhancement of Printed Circuit Boards Using Turbulators

被引：0
|
作者：
Chan, P. K.
Toh, K. C.
Chan, W. K.
Leong, K. C.
机构：
来源：
IES Journal | 1994年 / 34卷 / 07期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS
    Kursun, B.
    Sivrioglu, M.
    JOURNAL OF THERMAL ENGINEERING, 2018, 4 (02): : 1791 - 1802
  • [2] Experimental investigation of the influence of reaction atmosphere on the pyrolysis of printed circuit boards
    Evangelopoulos, Panagiotis
    Kantarelis, Efthymios
    Yang, Weihong
    APPLIED ENERGY, 2017, 204 : 1065 - 1073
  • [3] Heat transfer enhancement using U-shaped flow routing plates in cooling printed circuit boards
    Kursun, Burak
    Sivrioglu, Mecit
    JOURNAL OF THE BRAZILIAN SOCIETY OF MECHANICAL SCIENCES AND ENGINEERING, 2018, 40 (01)
  • [4] Investigation of vibration characteristics of printed circuit boards
    Wang, WC
    Cheng, CB
    EXPERIMENTAL MECHANICS, VOLS 1 AND 2: ADVANCES IN DESIGN, TESTING AND ANALYSIS, 1998, : 969 - 974
  • [5] Printed circuit boards isomorphism: An experimental study
    Abiad, Aida
    Grigoriev, Alexander
    Niemzok, Stefanie
    COMPUTERS & INDUSTRIAL ENGINEERING, 2020, 148
  • [6] Heat transfer enhancement of electronic devices by using flexible printed circuit boards
    Emad, Mustafa
    Aljabair, Sattar
    Imran, Ahmed Abdulnabi
    JOURNAL OF THERMAL ENGINEERING, 2023, 9 (06): : 1531 - 1547
  • [7] Enhanced cooling of IC chip arrays on printed circuit boards
    Low, K.W.
    Yap, C.
    Proceedings of the Electronic Packaging Technology Conference, EPTC, 1998, : 229 - 235
  • [8] The enhanced cooling of IC chip arrays on printed circuit boards
    Low, KW
    Yap, C
    2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 229 - 235
  • [9] Numerical and experimental investigation of noise coupling perturbed by ESD currents on printed circuit boards
    Huang, YS
    Wu, TL
    2003 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SYMPOSIUM RECORD, VOLS 1 AND 2, 2003, : 43 - 47
  • [10] Microfibrous metallic cloth for damping enhancement in printed circuit boards
    Burch, Nesha H.
    Black, Meagan N.
    Dean, Robert N.
    Flowers, George T.
    ACTIVE AND PASSIVE SMART STRUCTURES AND INTEGRATED SYSTEMS 2010, PTS 1 AND 2, 2010, 7643
12345