HIGH PERFORMANCE MMIC HERMETIC PACKAGING.

被引：0

作者：

Ziegner, Bernhard A. ^{[1
]}

机构：

[1] M/A-Com Advanced Semiconductor, Operations, Lowell, MA, USA, M/A-Com Advanced Semiconductor Operations, Lowell, MA, USA

来源：

Microwave journal | 1986年 / 29卷 / 11期

关键词：

CERAMIC MATERIALS - Applications - MICROWAVE DEVICES - Electronics Packaging;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

A high-performance ceramic-based packaging for hermetic housing of GaAs MMIC (monolithic microwave integrated circuit) devices has been developed. A standardized (G-S-G) RF interconnection technique is used to facilitate installation into rf subassemblies. A reliable and low thermal impedance mounting of the MMIC chip is assured by the chip/carrier subassembly and the package thermal vias. Insertion loss of each input and output port is less than 0. 25 db through X band wih the input-output isolation greater than 50 db.

引用

页码：133 / 134