NEW PACKAGE 'FULL PACK' FOR POWER DEVICES.

被引：0
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作者：
Yokozawa, Masami
Tateno, Kenichi
Wada, Fujio
Fujii, Hiroyuki
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来源：
National technical report | 1983年 / 29卷 / 02期
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摘要：
INTEGRATED CIRCUIT MANUFACTURE
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页码：343 / 350
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