Are you ready for lead-free assembly?

被引：0

作者：

Jones, Greg ^{[1
]}

机构：

[1] KIC Thermal Profiling, 15950 Bernardo Center Drive, # E, San Diego, CA 92127, United States

来源：

Surface mount technology | 2000年 / 14卷 / 06期

关键词：

Industrial electronics - Laws and legislation - Marketing - Soldering - Soldering alloys;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The lead-free assembly challenge lies in using technology that allows electronics assemblers to maintain optimal thermal processes in the reduced lead-free process window. Lead-free solders reach liquidus at temperatures 20° to 50 °C higher than the lead-based solders conventionally used. Because many components cannot tolerate peak temperature above 235 °C, one characteristic of lead-free solders will be reduce the process window. Strategies for minimizing the challenges associated with this reduced process window, and the opportunities for optimizing the thermal process are discussed.

引用

页码：60 / 62