HIGH RELIABILITY THROUGH CHIP COMPLEXITY.

被引：0
作者：
Hilibrand, Jack
Anderson, Kenneth R.
机构：
来源：
RCA Engineer | 1980年 / 25卷 / 04期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
SEMICONDUCTOR DEVICES, MIS
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页码：22 / 26
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