HIGH RELIABILITY THROUGH CHIP COMPLEXITY.

被引：0
|
作者：
Hilibrand, Jack
Anderson, Kenneth R.
机构：
来源：
RCA Engineer | 1980年 / 25卷 / 04期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
SEMICONDUCTOR DEVICES, MIS
引用
收藏
页码：22 / 26
相关论文
共 50 条
  • [21] RELIABILITY OF COPPER-PLATED-THROUGH-HOLE PRINTED WIRING BOARD.
    Kobuna, Hideaki
    Sato, Takao
    Noguchi, Setsuo
    1600,
  • [22] IMPROVED COST-EFFECTIVENESS AND PRODUCT RELIABILITY THROUGH SOLDER ALLOY DEVELOPMENT
    OLSEN, DR
    SPANJER, KG
    SOLID STATE TECHNOLOGY, 1981, 24 (09) : 121 - 126
  • [23] High reliability technology of the weld zone of high-frequency electric resistance welding linepipes
    Tubular Products and Casting Res. Dept., Steel Res. Lab., JFE Steel, Japan
    不详
    不详
    JFE Tech. Rep., 20 (125-132):
  • [24] Managing risk in space operations - Creating and maintaining a high reliability organization
    Fuller, David A.
    Collect. Tech. Pap. AIAA Space Conf. Expos., 1600, (218-223):
  • [25] Failure and Reliability of Shafts of High-Capacity Piston Compressors.
    Berezovskii, L.B.
    Problemy Prochnosti, 1980, (01):
  • [26] An examination of high-speed aircraft – Part 2: Safety and reliability
    Pollock, Luke
    Wild, Graham
    Transportation Engineering, 2024, 18
  • [27] High sensitivity pH sensing by using a ring resonator laser integrated into a microfluidic chip
    Li, Dong-Yang
    Zhang, Han
    Li, Zhi
    Zhou, Ling-Wei
    Zhang, Meng-Da
    Pu, Xiao-Yun
    Sun, Yu-Ze
    Liu, Hang
    Zhang, Yuan-Xian
    OPTICS EXPRESS, 2022, 30 (03) : 4106 - 4116
  • [28] Transferring research through high performance computing
    Lindberg, Donald A.B.
    Studies in Health Technology and Informatics, 2000, 76 : 3 - 10
  • [29] DEVELOPMENT AND RELIABILITY STUDY ON HIGH VOLTAGE RCP-XLPE CABLES.
    Yamada, Y.
    Matsubara, H.
    Fukunaga, S.
    Yatsuka, K.
    Proceedings of the Technical Programme - INTERNEPCON: International Electronic Packaging and Production Conferences, 1979, : 386 - 390
  • [30] Environmental Reliability Evaluation of the Ultrasonic Bonded Metal with High- Temperature Test
    Sungkyunkwan University, School of Advanced Materials Science and Engineering, Gyeonggi-Do, Suwon
    16419, Korea, Republic of
    Int. Conf. Electron. Packag., ICEP, 2022, (51-52):
12345