HIGH RELIABILITY THROUGH CHIP COMPLEXITY.

被引：0
|
作者：
Hilibrand, Jack
Anderson, Kenneth R.
机构：
来源：
RCA Engineer | 1980年 / 25卷 / 04期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
SEMICONDUCTOR DEVICES, MIS
引用
收藏
页码：22 / 26
相关论文
共 50 条
  • [1] MEASURES OF PROGRAMMING COMPLEXITY.
    Kitchenham, Barbara A.
    ICL technical journal, 1981, 2 (03): : 298 - 316
  • [2] HOW TO APPLY COMPLEXITY.
    Nelson, W.L.
    1600, (74):
  • [3] ON THE USE OF THE CYCLOMATIC NUMBER TO MEASURE PROGRAM COMPLEXITY.
    Elshoff, James L.
    Marcotty, Michael
    1978,
  • [4] AUTONOMOUS ANTITONE SEQUENTIAL CIRCUITS - 4. ESTIMATES OF THE COMPLEXITY.
    Starodubtsev, N.A.
    1600, (20):
  • [5] POWER-FET AMPLIFIER DESIGNS BOOST FIDELITY, REDUCE COMPLEXITY.
    Harvey, Barry
    EDN, 1980, 25 (17) : 137 - 142
  • [6] NOTE ON THE LAW OF ITERATED LOGARITHM FROM THE VIEWPOINT OF KOLMOGOROV PROGRAM COMPLEXITY.
    Kramosil, I.
    Sindelar, J.
    1600, (16):
  • [7] Managing Complexity through Collaborative Intelligence
    Maa, Mary EI
    Derkatsch, Alexander IN
    DeTurris, Dianne J
    INCOSE International Symposium, 2022, 32 (01) : 1267 - 1287
  • [8] Assembly & reliability of flip chip-on-laminate with lead free solder
    Hou, Zhenwei
    Tian, Guoyun
    Hatcher, Casey
    Johnson, R. Wayne
    Yaeger, Erin
    Konarski, Mark
    Crane, Larry
    Advancing Microelectronics, 29 (02):
  • [9] MULTICHIP PACKAGING FOR HIGH DENSITY AND HIGH RELIABILITY.
    Greig, William J.
    Moneika, Paul J.
    Brown, Richard A.
    RCA Engineer, 1979, 24 (06): : 41 - 46
  • [10] A reliability evaluation method of high reliability products based on evidence fusion
    School of Finance and Banking, University of International Business and Economics, Beijing
    100029, China
    不详
    100029, China
    不详
    101149, China
    Xitong Gongcheng Lilum yu Shijian, 11 (2979-2986):
12345