INVESTIGATION INTO THE MISCIBILITY OF COPPER IN TIN-LEAD AND LEAD-TIN SOLDER ALLOYS.

被引：0

作者：

Szymanski, Jan

机构：

来源：

Schweissen und Schneiden/Welding and Cutting | 1986年 / 38卷 / 07期

关键词：

METALLOGRAPHY - MICROSCOPIC EXAMINATION;

D O I：

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学科分类号：

摘要：

The object of the investigation is to determine the miscibility of copper in the solder alloys L-Sn90Pb and L-PdSn30 from the loss of thickness of a copper strip. It can be seen that with a limited volume of solder, a braking effect is exerted while the copper is dissolving which can have an important bearing on the soldering process. Attempts were therefore made to determine the dissolution behavior of the copper in a restricted volume of solder.

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