LIQUID COVERCOATS FOR FLEXIBLE PRINTED CIRCUITS.

被引：0

作者：

Holland, Daniel L.

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来源：

| 1600年 / 18期

关键词：

Compendex;

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摘要：

PRINTED CIRCUITS

引用

共 50 条

[1] FLEXIBLE PRINTED CIRCUITS.
Shiraishi, Kazuaki
1978, 24 (01): : 127 - 133
[2] TERMINATION OF FLEXIBLE PRINTED CIRCUITS TO RIGID PRINTED CIRCUITS.
Anon
IBM technical disclosure bulletin, 1986, 28 (12):
[3] MESA FLEXIBLE PRINTED CIRCUITS.
Matsumoto, Kazuhiro
Kobayashi, Tadashi
Inaba, Keiji
1600, (28):
[4] Mechanical Machining of Flexible Printed Circuits.
Thielemann, Juergen
1600, (40):
[5] PACKAGING PRINTED CIRCUITS.
Wolfson, Marv
Computer-Aided Engineering, 1988, 7 (05):
[6] TYPES OF PRINTED CIRCUITS.
Kalmus, Christopher
Insulation, circuits, 1980, 26 (02):
[7] METHODS FOR PRODUCING SOLDERABLE, RIGID TERMINALS ON FLEXIBLE PRINTED CIRCUITS.
Jean, Larry H.
1978, 24 (02): : 45 - 47
[8] Solderability Testing of Printed Circuits.
Clarmo, Goran
1600,
[9] GOLD PLATING OF PRINTED CIRCUITS.
Parker, Edward
Shoushanian, Hrant
1976, 22 (10): : 49 - 55
[10] POLYMER COATINGS FOR PRINTED CIRCUITS.
Holland, Daniel L.
1600,