LIQUID COVERCOATS FOR FLEXIBLE PRINTED CIRCUITS.

被引：0

作者：

Holland, Daniel L.

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来源：

| 1600年 / 18期

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Compendex;

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摘要：

PRINTED CIRCUITS

引用

共 50 条

[1] METHODS FOR PRODUCING SOLDERABLE, RIGID TERMINALS ON FLEXIBLE PRINTED CIRCUITS.
Jean, Larry H.
1978, 24 (02): : 45 - 47
[2] Solderability Testing of Printed Circuits.
Clarmo, Goran
1600,
[3] Repair Soldering of Printed Circuits.
Mueller, Helmut
Schweisstechnik (Berlin), 1979, 29 (04): : 153 - 155
[4] EXPLOSION WELDING REPAIRS PRINTED CIRCUITS.
Bangs, Scholer
Welding Design and Fabrication, 1982, 55 (05): : 51 - 52
[5] ACID COPPER PLATING OF PRINTED CIRCUITS.
Malak, Thomas P.
Products Finishing (Cincinnati), 1981, 45 (06): : 38 - 44
[6] FACTORS TO CONSIDER WHEN USING AND FABRICATING FLEXIBLE CIRCUITS.
Lamoureux, R.T.
Electronic Packaging and Production, 1979, 19 (07): : 176 - 179
[7] SILICON INTEGRATED CIRCUITS.
Kahng, Dawon
Applied Solid State Science, 1981, (pt A):
[8] Design of Rectifier Circuits.
Fleischmann, Dieter
Nachrichten Elektronik, 1980, 34 (08): : 281 - 282
[9] MANUFACTURE OF MONOLITHIC CIRCUITS.
Jerndal, Ulf
Novak, Eva
Ericsson Review (English Edition), 1981, 58 (02): : 50 - 55
[10] MICROMANIPULATION OF SMALL CIRCUITS.
Smith, J.D.
Woore, J.
1976,