THICK-FILM HYBRID CIRCUITS CHARACTERISTICS, MANUFACTURE AND APPLICATION.

被引:0
|
作者
Vogel, P.
机构
来源
Hasler review | 1980年 / 13卷 / 3-4期
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D O I
暂无
中图分类号
TN7 [基本电子电路];
学科分类号
080902 ;
摘要
The position of the thick-film technology in the hierarchy of an electronic hardware system is analyzed, followed by a discussion of the various thick-film elements. The description of the process is based primarily on the design aids and manufacturing equipment installed in our company. Strong emphasis is given to the circuit design, the layout, and laser trimming. The article concludes with a brief discussion of today's applications.
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页码:38 / 47
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