Effects of depositing temperature and film thickness on residual stress of TiN coated materials

被引：0

作者：

Matsue, Tatsuya ^{[1
]}

Hanabusa, Takao ^{[1
]}

Ikeuchi, Yasukazu ^{[1
]}

机构：

[1] Niihama Natl Coll of Tech, Niihama, Japan

来源：

Zairyo/Journal of the Society of Materials Science, Japan | 1995年 / 44卷 / 504期

关键词：

Compressive residual stress - Depositing temperature - Film thickness effect - Lattice strain - Multi-arc physical vapour deposition method - Thermal expansion coefficient - Thermal residual stress - Thermal strain mismatch - Titanium nitride coated materials - X-ray stress measurement;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

This study investigates the residual stress in TiN film deposited on a substrate of spring steel by a multi-arc method as a function of depositing temperature and film thickness. The residual stress in the substrate layer near the interface is also investigated. The TiN film exhibits virtually {111} orientation. The residual stress in the TiN film is evaluated by the two-exposure method. The results show a compressive residual stress of -5.5 GPa to -3.5 GPa. The residual stress value has depended greatly on the depositing temperature. The residual stress in the substrate is compressive and below -30 MPa.

引用

页码：1121 / 1126

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