Effects of depositing temperature and film thickness on residual stress of TiN coated materials

被引：0
|
作者：
Matsue, Tatsuya [1 ]
Hanabusa, Takao [1 ]
Ikeuchi, Yasukazu [1 ]
机构：
[1] Niihama Natl Coll of Tech, Niihama, Japan
来源：
Zairyo/Journal of the Society of Materials Science, Japan | 1995年 / 44卷 / 504期
关键词：
Compressive residual stress - Depositing temperature - Film thickness effect - Lattice strain - Multi-arc physical vapour deposition method - Thermal expansion coefficient - Thermal residual stress - Thermal strain mismatch - Titanium nitride coated materials - X-ray stress measurement;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This study investigates the residual stress in TiN film deposited on a substrate of spring steel by a multi-arc method as a function of depositing temperature and film thickness. The residual stress in the substrate layer near the interface is also investigated. The TiN film exhibits virtually {111} orientation. The residual stress in the TiN film is evaluated by the two-exposure method. The results show a compressive residual stress of -5.5 GPa to -3.5 GPa. The residual stress value has depended greatly on the depositing temperature. The residual stress in the substrate is compressive and below -30 MPa.
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页码：1121 / 1126
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