Microwave flip chip and BGA technology

被引：0
|
作者：
Bedinger, John M. [1 ]
机构：
[1] Raytheon Electronics Corp, Dallas, United States
来源：
IEEE MTT-S International Microwave Symposium Digest | 2000年 / 2卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Integrated circuit manufacture
引用
收藏
页码：713 / 716
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