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- [31] DESIGN OF A FAST HIGH-DENSITY Z PINCH BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1977, 22 (09): : 1162 - 1162
- [32] CALCULATION OF CAPACITANCES OF CHIP-TO-CHIP INTERCONNECTIONS ON A HIGH-DENSITY MULTICHIP PACKAGE PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, 1988, : 202 - 212
- [33] Study of low temperature cofired AIN/glass composite for high-density package Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics, 2003, 23 (04): : 520 - 525
- [34] Nanocrystalline copper and nickel as ultra high-density chip-to-package interconnections 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1647 - 1651
- [35] Design of high-density interconnects for high-speed transmission 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 352 - +
- [36] EUROCARD DESIGN PROVIDES HIGH-DENSITY INTERCONNECT STANDARD ELECTRONIC PRODUCTS MAGAZINE, 1983, 25 (10): : 73 - 75
- [38] High-Density Computing - Efficient versus Conventional Design PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2015, VOL. 14, 2016,
- [40] HIGH-DENSITY FPGAS FOR SYNTHESIS AND VHDL BASED DESIGN ELECTRONIC PRODUCT DESIGN, 1995, 16 (02): : 49 - &