SOLDER FUSING - A PANACEA OR PITFALL.

被引：0

作者：

Kingsley, D.S.

机构：

来源：

Transactions of the Institute of Metal Finishing | 1979年 / 57卷 / pt 1期

关键词：

Compendex;

D O I：

10.1080/00202967.1979.11870478

中图分类号：

学科分类号：

摘要：

Solder fusing is now an accepted and widely specified process finish for printed circuit boards. The principle and practices of fusing are given in this paper, together with the metallurgical aspects of the subsequent metal to metal bonds. Recent work by the author's company has shown a phenomenon of non-wetting occurring at the ″knee″ of the through-plated hole during solderability testing, and an investigation into the cause is described, together with the British Standard requirements for wetting of through-plated holes.

引用

页码：7 / 10

页数：3