IC ASSEMBLY EQUIPMENT UNITS BEING COMBINED INTO FULLY INLINE SYSTEM.

被引：0

作者：

Kobayashi, Eiichi ^{[1
]}

机构：

[1] Tokyo Sanyo Electric Co, Jpn, Tokyo Sanyo Electric Co, Jpn

来源：

JEE. Journal of electronic engineering | 1986年 / 23卷 / 232期

关键词：

ELECTRONICS PACKAGING;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The increased density and high-efficiency production of semiconductor devices have brought about a fall in IC prices. Particularly remarkable is the streamlining of the IC assembly process. This article deals mainly with dicing, die bonding, wire bonding and molding which form the core of the IC assembly process.

引用

页码：44 / 46

共 2 条

[1] Structural and Technological Solutions Used in the Manufacture and Assembly of Functional Units of an Aerodynamically Stabilized Aerostatic System.
Bakmaev, Sabir Magomed-Kadievich
Vorontsov, Ilia Sergeevich
Tarasenko, Andrey Valerievich
Demskiy, Dmitry Aleksandrovich
RESEARCH JOURNAL OF PHARMACEUTICAL BIOLOGICAL AND CHEMICAL SCIENCES, 2016, 7 (05): : 677 - 683
[2] Transmic System. 48, 56, 64 and 72 kbit/s Data Transmission Equipment Units.
Lachaise, Jean
Houard, Gerard
Filaferro, Rene
Lemoussu, Michel
1978, 32 (04): : 574 - 596

← 1 →