Wafer-level chip-scale package favors small-form-factor ASICS

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作者：
Allan, Roger
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来源：
Electronic Design | 2004年 / 52卷 / 09期
关键词：
Application specific integrated circuits - Approximation theory - Ball grid arrays;
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摘要：
A fully qualified, high-performance, low-power, and small-form-factor wafer-level chip scale package (W-CSP) has been developed by Oki Semiconductor. The product is available in BGA- and LGA-type styles, and targets chip sizes from 2 by 2 mm up to 8 by 8 mm with pin counts up to 250 pins. The package has the same pin count of other packages, yet it is half the size of a fine-pitch BGA package and one-fourth the size of a fine-pitch QFP package. The W-CSP, which is made up of a molded halogen-free resin with a thickness as small as 0.4 mm, the package has a reliability rating equivalent to conventional packages.
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