Evolution of microstructure and texture in sputter-deposited TiN films for interconnect applications

被引：0
|
作者：
Hobbs, A.
Inoue, K.
Nakamura, T.
机构：
[1] Trinity College Dublin, Ireland
[2] Fujitsu Laboratories Ltd.
[3] Applied Physics Society of Japan
[4] University of Iwate, Iwate, Japan
[5] Fujitsu Ltd., Kawasaki, Japan
[6] Shizuoka University, Shizuoka, Japan
[7] University of Tokyo, Tokyo, Japan
[8] Fujitsu Laboratories Ltd., Atsugi, Japan
[9] Applied Physics Society of Japan, Inst. Electronics, Info. Commun. E.
来源：
Fujitsu Scientific and Technical Journal | 1996年 / 32卷 / 01期
关键词：
D O I：
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学科分类号：
摘要：
Metallic films
引用
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页码：142 / 150
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